laser in the cutting, engraving process, do not contact the surface of the
object, to ensure the quality of each product, improve the competitiveness of
A focused beam of light heats the surface of the material to its boiling
point, creating a keyhole. Locking causes a sudden increase in absorption and
rapid deepening of the pores. The hole deepens, and the steam from boiling
erodes the wall, spraying out a spray and enlarging the hole further.
Non-melting materials such as wood, carbon, and thermosetting plastics are
usually cut in this way.
The molten material is blown from the cutting zone by high-pressure gas,
which greatly reduces the power requirement of the molten material. The material
laser cutting service plastic first heated to the melting point, and then the
molten material is blown off by air to avoid further raising the temperature of
the material. The material that is cut in this way is usually metal.
Thermal stress cracking:
Brittle materials are particularly sensitive to thermal fracture, which is
one of the characteristics of thermal stress crack. The concentration of light
on the surface causes local heating and thermal expansion, which creates cracks
that are then guided by moving beams. Cracks can move in m/s order. It is
usually used to cut glass.
Silicon wafer invisible cutting:
Using silicon semiconductor devices to separate microelectronic chips from
silicon wafers, a so-called stealth cutting process can be used. Pulsed Nd:YAG
laser with wavelength of 1064 nm is very suitable for silicon electronic band
gap (1.11 electron volts or 1117 nm).
Also known as combustion stabilized laser cutting and flame cutting. Reaction
cutting is like oxygen torch cutting, but the laser beam is the ignition source.
Suitable for cutting carbon steel with thickness greater than 1mm. This method
can cut very thick steel plates with relatively little laser power.
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