CNC Machining Parts
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laser in the cutting, engraving process, do not contact the surface of the object, to ensure the quality of each product, improve the competitiveness of enterprises;

Vaporization cutting:

A focused beam of light heats the surface of the material to its boiling point, creating a keyhole. Locking causes a sudden increase in absorption and rapid deepening of the pores. The hole deepens, and the steam from boiling erodes the wall, spraying out a spray and enlarging the hole further. Non-melting materials such as wood, carbon, and thermosetting plastics are usually cut in this way.


The molten material is blown from the cutting zone by high-pressure gas, which greatly reduces the power requirement of the molten material. The material laser cutting service plastic first heated to the melting point, and then the molten material is blown off by air to avoid further raising the temperature of the material. The material that is cut in this way is usually metal.

Thermal stress cracking:

Brittle materials are particularly sensitive to thermal fracture, which is one of the characteristics of thermal stress crack. The concentration of light on the surface causes local heating and thermal expansion, which creates cracks that are then guided by moving beams. Cracks can move in m/s order. It is usually used to cut glass.

Silicon wafer invisible cutting:

Using silicon semiconductor devices to separate microelectronic chips from silicon wafers, a so-called stealth cutting process can be used. Pulsed Nd:YAG laser with wavelength of 1064 nm is very suitable for silicon electronic band gap (1.11 electron volts or 1117 nm).

Reaction cutting:

Also known as combustion stabilized laser cutting and flame cutting. Reaction cutting is like oxygen torch cutting, but the laser beam is the ignition source. Suitable for cutting carbon steel with thickness greater than 1mm. This method can cut very thick steel plates with relatively little laser power.

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