High-Flexibility CNC Machining Parts - Laser Cutting Technology

High-Flexibility CNC Machining Parts - Laser Cutting Technology

High-flexibility CNC machining parts using laser cutting technology offer precise and intricate cutting capabilities for various materials. With the ability to produce complex shapes and designs with high accuracy, users can achieve superior quality results. This cutting-edge technology allows for increased efficiency and cost-effectiveness in manufacturing processes.

Laser cutting programming can cut stainless steel pipe with anything, the perfect cutting laser can be in any direction, through the computer programming can be quickly and flexible change in response to the shape of the laser tube cutting tool with high flexibility for a growing number of single processing provides strong technical support, thus reducing the use of the mold.

Products Details

Product advantages

Our High-Flexibility CNC Machining Parts utilize cutting-edge Laser Cutting Technology to create precise and complex designs with unparalleled accuracy. These parts offer superior flexibility and versatility in manufacturing, allowing for the production of intricate components with ease. With high precision and speed, our CNC machining parts are ideal for a wide range of industries and applications.

We serve

At our company, we serve with a commitment to excellence in high-flexibility CNC machining parts using cutting-edge laser cutting technology. Our skilled team of experts ensures precision and high-quality results for every project. We strive to meet the unique needs of our customers with fast turnaround times and cost-effective solutions. We understand the importance of efficiency and accuracy in the manufacturing industry, and we are dedicated to providing top-notch service. Trust us to deliver reliable, top-of-the-line CNC machining parts that exceed your expectations. Experience the difference with our unparalleled commitment to serving your needs.

Why choose us

At our company, we serve with a commitment to high-quality CNC Machining Parts using cutting-edge Laser Cutting Technology. Our products are designed for maximum flexibility and precision, ensuring optimal performance for a wide range of applications. We prioritize customer satisfaction by offering exceptional customization options and fast turnaround times. With a team of skilled technicians and state-of-the-art equipment, we guarantee top-notch products that meet the strictest industry standards. Trust us to deliver reliable solutions that exceed your expectations, every time. Experience the difference with our innovative CNC Machining Parts – where quality and precision meet excellence.

laser in the cutting, engraving process, do not contact the surface of the object, to ensure the quality of each product, improve the competitiveness of enterprises;


Vaporization cutting:


A focused beam of light heats the surface of the material to its boiling point, creating a keyhole. Locking causes a sudden increase in absorption and rapid deepening of the pores. The hole deepens, and the steam from boiling erodes the wall, spraying out a spray and enlarging the hole further. Non-melting materials such as wood, carbon, and thermosetting plastics are usually cut in this way.


Melt:


The molten material is blown from the cutting zone by high-pressure gas, which greatly reduces the power requirement of the molten material. The material laser cutting service plastic first heated to the melting point, and then the molten material is blown off by air to avoid further raising the temperature of the material. The material that is cut in this way is usually metal.


Thermal stress cracking:


Brittle materials are particularly sensitive to thermal fracture, which is one of the characteristics of thermal stress crack. The concentration of light on the surface causes local heating and thermal expansion, which creates cracks that are then guided by moving beams. Cracks can move in m/s order. It is usually used to cut glass.


Silicon wafer invisible cutting:


Using silicon semiconductor devices to separate microelectronic chips from silicon wafers, a so-called stealth cutting process can be used. Pulsed Nd:YAG laser with wavelength of 1064 nm is very suitable for silicon electronic band gap (1.11 electron volts or 1117 nm).


Reaction cutting:


Also known as combustion stabilized laser cutting and flame cutting. Reaction cutting is like oxygen torch cutting, but the laser beam is the ignition source. Suitable for cutting carbon steel with thickness greater than 1mm. This method can cut very thick steel plates with relatively little laser power.


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